Hi All,
I'm trying to get my Parallella (purchased late 2016) mounted into the aluminium case (just received) and am following this post/video: https://www.parallella.org/2016/12/21/t ... -paracase/
Two (or so) questions:
1. My board already has the included heat sink attached. Is there a safe way of removing this so I can use the case? How does one go about doing this?
2. My case did not come with the non-conductive adhesive thermal material mentioned in this video—should it have? If not, can I get one somewhere?
When I do get ahold of the adhesive, can I mount the thermal plate to the heat sink effectively? The heat sink is only making contact with 1 chip, however, so it may not be ideal.
Thanks,
sp